|Minimum Order Quantity||500 Piece|
|Packaging Type||LDPE Bag|
|Melting Point Range||100 DegreeC-130 DegreeC|
|Curing Time||24 hours|
|Open Time||5-10 minutes|
|Chemical Type||Polyurethane Hot Melt|
|Boiling Point Range||100 DegreeC-130 DegreeC|
KH-112B hot melt glue is a one-component reactive polyurethane hot melt adhesive. This reactive hot melt adhesive is solid at room temperature. After heating, it will cool for immediate handling. Upon further exposure to ambient humidity, KH-112B hot melt glue will achieve a high strength bond and excellent environmental resistance.
Bonding of components for branded cell phones, smartphones, tablets, wearable devices and other electronic devices
Typical uncured properties
Typical Curing Characteristics
For optimal results, make sure that the parts are dry, clean, and free of grease and oil. However, good bonding can still be achieved on parts that are "as received" or slightly oily. The substrate''s temperature shouldn''t be any lower than 20°C. Low temperature will shorten the open time and cause the bonding failure. Pre-heating the substrate is advised if necessary. Dispense bead of product onto substrate. Within the suggested open time, mate with the opposing substrate. Allow for handling strength to be achieved.
Optimal storage conditions are between 15°C to 30°C and stored in original sealed foil bag. Storage outside this temperature range can adversely affect product properties and may reduce the stated shelf life.