Solder Flux

Product Details:

Flux paste offers good soldering performance for rugged and stable application. It is easy to use and quickly cleaned. Its surface insulation resistance is extremely high and it is suitable for soldering general instruments and metal components made from copper, tin, and iron. It is often applied for both lead soldering and lead-free soldering.

Usage:

• First, wipe the surface of the components. Coat the soldered metal like copper, tin and iron with flux paste. And then melt the tin with the soldering iron on the welding box.

Jufeng Solder offers two packaging operations:

• One is a syringe packing type: JF-4302 flux paste (ROL1), JF-4304 flux paste (ROL0).
• The other is a box packing type:JF-4303 flux paste (ROL0), JF-4301 flux paste (RA). It is easy to carry and use.

Storage and Warranty:

• Avoid direct sunlight. Keep in a cool, dry place.
• Under normal storage conditions, the warranty is 12 months.

Product Details:

The soldering flux is designed to help promote the soldering process. It is a chemical substance the protects the surface and prevents oxidation on the metal to be joined by soldering. The surface remains unchanged before and after the soldering process. The soldering flux is a natural soldering material with rosin as its primary component. With minimal smoke created, it does not pollute the working environment or negatively affect operator health.

Applications:

• With regard to the high-stability welding of electronic components, this soldering flux can conform to two kinds of rigorous standards, including MIL-P-28809 and IPC-818. Therefore, it is highly reliable when applied in electronic communications products, computer automatic products, computer mainframes, computer interface devices, etc.

Product Details:

Our lead free solder flux is often used for the wave soldering process, because its wetting property is specially designed. It allows the solder joints to be bright and full. Inside our product, the proper amount of solids and the internal activity mechanism can make sure that very few residues are found after the circuit board is welded. Moreover, the surface of the circuit board is dry and clean.

This product can avoid the cleaning procedure and then help manufacturers save much production cost, if there are no special requirements. Owing to its outstanding welding performance, our lead free solder flux is able to reduce the bridging or other defects as much as possible during the wave soldering process.

With regard to the high-stability welding of electronic components, this lead free solder flux can conform to two kinds of rigorous standards, including MIL-P-28809 and IPC-818 standards. Therefore, it is highly reliable when applied in the electronic communications products, computer automation products, computer motherboards, computer interface devices, and some others.

Furthermore, our product is applicable for the wave soldering, foam type soldering, spray type soldering, and other types of processes. During the foam type soldering process, the size of the pore in foaming petroleum should range from 0.005mm to 0.01mm. For maintaining the ideal foaming effect, the height of the flux must be at least 1 inch higher than that of the foaming stone.

Main Characteristics:

• The surface remains unchanged before and after the soldering process. It features no residue and no viscosity.
• Our lead free solder flux does not produce any corrosive residue.
• Due to low smoke, this product does not pollute the working environment, or affect the human health.
• Its surface insulation resistance is extremely high.
• Moreover, this product has passed the strict copper-mirror test.