Product Details:
Brand | Jufeng |
Usage/Application | Industrial |
Weight | 500g/bottle, 10kg/box |
Model Name/Number | Sn96.5Ag3.0Cu0.5 SAC305 |
Melting Point | 217-219 Deg C |
Specific Gravity | 7.40 g/cm3 |
Tensile Strength | 53.3 MPa |
Appearance | Adhesive paste in grayish black |
Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste adopts the alloy which is formed by the 96.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 130 degrees Celsius to 170 degrees Celsius. The melting temperature is 217 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.
The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. Moreover, we are looking for agents on a global scale. Please contact us, if you show interest in our product.
Type | Chemical Composition (wt. %) | |||||||
Sn | Pb | Sb | Cu | Ag | Fe | Al | Cd | |
Sn96.5Ag0.3Cu0.5 | Bal | < 0.1 | < 0.1 | 0.5±0.2 | 3.0±0.2 | < 0.02 | < 0.001 | < 0.002 |
Type | Melting Point, ??? | Specific Gravity, g/cm3 | Tensile Strength, MPa |
Sn96.5-Ag3.0-Cu0.5 | 217-219 | 7.40 | 53.3 |
Specification | Sn99-Ag3.0-Cu0.5 |
Appearance | Adhesive paste in grayish black |
Weight | 500g/bottle, 10kg/box |
Product Details:
Usage/Application | Industrial |
Brand | Jufeng |
Model | Sn99Ag0.3Cu0.7 |
Appearance | Adhesive paste in grayish black |
Weight | 500g/bottle, 10kg/box |
Packaging Type | Bottle |
The Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste puts to use the alloy, comprising the 99% tin, the 0.3% lead and the 0.7% copper. With the melting point of 227 degrees Celsius, this product is fit for the reflow soldering process which has relatively high demand. Its preheat temperature ranges from 130 degrees Celsius to 170 degrees Celsius. Its reflow temperature varies from 280 degrees Celsius to 200 degrees Celsius.
In addition, the flux contained in our Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste takes advantage of the highly reliable low-ion type halogen activator. In other words, our product features extremely high reliability, even if it is not cleaned after the reflow soldering process.
The no-clean type lead free solder cream is applicable for the electronic PCB and SMT. There is no need to clean our product with other chemical agent. This product can be spread on the circuit board automatically, which offers much convenience and environmental protection.
Chemical Composition:
Type | Chemical Composition (wt. %) | |||||||
Sn | Pb | Sb | Cu | Ag | Fe | Al | Cd | |
Sn99Ag0.3Cu0.7 | Bal | < 0.1 | < 0.1 | 0.7±0.2 | 0.3±0.1 | < 0.02 | < 0.001 | < 0.002 |
Applications:
Packing:
Product Details:
Brand | Jufeng |
Usage/Application | Industrial |
Model Name/Number | Sn64Bi35Ag1 |
Country of Origin | Made in India |
Packaging Type | Bottle |
Preheat Temperature | 110 to 160 degrees Celsius |
Reflow Temperature | 210 to 150 degrees Celsius |
The Sn64Bi35Ag1 mid temperature lead free solder paste indicates that the alloy consists of the 64% tin content, the 35% bismuth content, and the 1% silver content. Its operating temperature can be divided into the preheat temperature from 110 degrees Celsius to 160 degrees Celsius, the melting point of 189 degrees Celsius, and the reflow temperature from 210 degrees Celsius to 150 degrees Celsius. This product is desirable for the reflow soldering process which has relatively high demand.
Moreover, the 1% silver content is doped with the active bismuth, which allows this type of tin paste to be applicable for the low or medium temperature type electrical equipment sets. Owing to the outstanding wetting property and soldering performance, this Sn64Bi35Ag1 mid temperature lead free solder paste is particularly suitable for the welding of circuit boards.
Applications:
Heating Rate | Time Required for Reaching 110ºC | Constant Temperature 110 - 138ºC |
Peak Temperature | 210±10??? | Cooling Rate |
1-3 ºC/sec | < 60-90 seconds | 60-100 seconds | 175 ±5ºC | 30-60 seconds | < 4ºC / S |
Type | Chemical Composition (wt. %) | ||||||
Sn | Bi | Ag | Pb | Fe | Al | Cd | |
Sn64-Bi35-Ag1 | 64±0.5 | 35±0.5 | 1±0.5 | < 0.01 | < 0.02 | < 0.001 | < 0.002 |
Established in 2006, Jufeng Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. With over a decade of experience in the soldering industry, we mainly supply a variety of solder wire, solder bar, solder paste, solder powder, flux, and the soldering machines, among others.
Product Details:
Brand | Jufeng |
Model Name/Number | Sn42Bi58 |
Weight | 500g/bottle, 10kg/box |
Usage/Application | Industrial |
Appearance | Adhesive paste in grayish black |
Preheat Temperature | 90 to 110 Deg C |
Reflow Temperature | 150 to 100 Deg C |
Our Sn42Bi58 for LED is a typical type of low-temperature lead free solder paste. Its alloy is made up of the 42% tin content and the 58% bismuth content. Its working temperature can be categorized into the preheat temperature from 90??? to 110???, the melting point of 138???, and the reflow temperature from 150??? to 100???. It is fit for the demanding reflow-soldering process.
This type of product has passed the SGS test. It also holds numerous certifications, such as RoHS, REACH, and some others. Additionally, it is accompanied with the related material safety data sheet, abbreviated as MSDS. The Sn42Bi58 low temperature lead free solder paste for LED has been exported to such countries as Pakistan, Iran, Colombia, Italy, Spain, Ukraine, Mexico, and more.
Uses:
Type | Chemical Composition (wt. %) | ||||||
Sn | Bi | Sb | Pb | Fe | Al | Cd | |
Sn42Bi58 | 42±0.1 | 58±0.5 | < 0.1 | < 0.1 | < 0.02 | < 0.001 | < 0.002 |
Product Details:
Usage/Application | Industrial |
Country of Origin | Made in India |
Brand | Jufeng |
Model | Sn63Pb37 |
Appearance | Adhesive Paste In Grayish Black |
Weight | 500g/bottle, 10kg/box |
Melting Point | 183 Deg C |
Gravity | 8.60 g/cm3 |
Tensile Strength | 51.3 MPa |
The Sn63Pb37 for PCB is a classic type of mid temperature tin lead solder paste. Its alloy comprises the 63% tin content and the 37% lead content. Its working temperature falls into the preheat temperature from 90 to 150 the melting point of 183 and the reflow temperature range from 190 to 100 This product is suitable for the highly demanding reflow-soldering process.
As one of the leaded series products developed by our company, the solder paste 63/37 can offer extremely good soldering effect. It has been exported to India, Russia, and other countries. Moreover, we are looking for agents around the world.
Applications:
Type | Chemical Composition (wt. %) | ||||||||
Sn | Pb | Sb | Cu | Bi | Zn | Fe | Al | Cd | |
Sn63Pb37 | 63±0.5 | Residue Content | < 0.2 | < 0.08 | < 0.1 | < 0.001 | < 0.02 | < 0.001 | < 0.002 |
Preservation Method:
Product Details:
Minimum Order Quantity | 50 kg |
Packaging Size | 500 gm |
Usage/Application | Industrial |
Physical State | Liquid |
Brand | Jufeng |
Model Name/Number | Sn62.8Pb36.8Ag0.4 |
Country of Origin | Made in India |
Packaging Type | Bottle |
The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made up of 62.8% tin, 36.8% lead, and 0.4% silver content.
This kind of solder paste is a no-clean type solder cream designed for SMT production processes. It is made from special flux and tin spherical powder with few oxide contents. The paste maintains its viscosity allowing for a high level continuous printing effect. In addition, the flux contained in our Sn62.8Pb36.8Ag0.4 solder paste takes advantages of the high reliable low-ion type halogen activator. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.
1. Main standards and methods for quality control
Composition | Content % |
Sn % | 62.8±0.5 |
Ag % | 0.4±0.1 |
Pb % | Remainder |
Cu % | ≤0.005 |
Bi % | ≤0.03 |
Fe % | ≤0.02 |
As % | ≤0.01 |
Ag % | ≤0.05 |
Zn % | ≤0.002 |
Al % | ≤0.001 |
Pb % | ≤0.05 |
Cd % | ≤0.002 |
Sb % | ≤0.002 |
Product Details:
Minimum Order Quantity | 300 Piece |
Packaging Size | 500 gm |
Usage/Application | For Soldering |
Physical State | Solid |
Weight | 45G |
Dimensions | Dia58*H70mm |
Model Name/Number | JF-SPB001 |
Country of Origin | Made in India |
Additional Information:
Product Details:
Minimum Order Quantity | 300 Piece |
Packaging Size | 500 gm |
Usage/Application | For Soldering |
Physical State | Solid |
Weight | 45G |
Dimensions | Dia58*H70mm |
Model Name/Number | JF-SPB002 |
Country of Origin | Made in India |
Additional Information:
Product Details:
Physical State | Solid |
Brand | Jufeng |
Usage/Application | Industrial |
Weight | 500g/bottle, 10kg/box |
Model Name/Number | Sn42Bi58 |
Country of Origin | Made in India |
Appearance | Adhesive Paste In Grayish Black |
Melting Point | 138 Deg CV |
Gravity | 8.6 g/cm3 |
Tensile Strength | 22HB Mpa |
The Sn42Bi58 is a common lead free solder paste with an alloy composed of 42% tin and 58% bismuth. It has a preheat temperature from 90??? to 110???, melting point of 138???, and the reflow temperature range from 150??? to 100???. It is suitable for the demanding reflow-soldering process.
The activated flux in this product delivers superior fluxing effects. The solder paste was developed for soldering electrical devices at low temperatures. With good wetting properties and soldering performance, it is commonly used for soldering LED circuit boards.
This type of product has passed SGS tests and also holds numerous certifications, such as RoHS and REACH. It is also accompanied with the related material safety data sheet and abrasives as MSDS. The Sn42Bi58 Low temperature solder paste has been exported to such countries as Pakistan, Iran, Colombia, Italy, Spain, Ukraine, Mexico, etc. What’s more, we are seeking agents on a global scale. Please don’t hesitate to contact us if you are interested in our products.
Type | Chemical composition (wt.%) | ||||||
Sn | Bi | Sb | Pb | Fe | Al | Cd | |
Sn42-Bi58 | 42±0.5 | 58±0.5 | < 0.02 | < 0.01 | < 0.02 | < 0.002 | < 0.003 |
Application | Type | Diameter | Content |
Standard printing | Alloy powder 3 | 25~45 μm | 89 % |
Fine pitch printing | Alloy powder 4 | 20~38 μm | 88.5 % |
Instill | Alloy powder 3 | 25~45 μm | 85 % |
Temperature rise speed | The time taken to get to 110 ??? | Constant temperature of 110 – 138 ??? | Peak temperature | > 138??? | Cooling speed |
1-3 ???/sec | < 60-90 sec | 60-100 sec | 175±5 ??? | < 30-60 sec | < 4 ???/sec |
Product Details:
Minimum Order Quantity | 10 Kg |
Usage/Application | Industrial |
Country of Origin | Made in India |
Brand | Jufeng |
Model | Sn62Pb36Ag2 |
Packaging Type | Bottle |
Appearance | Adhesive Paste In Grayish Black |
Weight | 500g/bottle, 10kg/box |
Preheat Temperature | 90 to 150 Deg C |
Melting Temperature | 183 Deg C |
Reflow Temperature | 190 to 100 Deg C |
Our Sn62Pb36Ag2 is a type of mid temperature tin lead solder paste. It means that the alloy is formed by the 62% tin content, the 36% lead content, and the 2% silver content. Its working temperature can be classified as the preheat temperature from 90??? to 150???, the melting temperature of 183???, and the reflow temperature from 190??? to 100???. Therefore, this product is suitable for the highly demanding reflow-soldering work.
The Sn62Pb36Ag2 solder paste is one of the leaded products developed by our company. It conforms to the surface mount technology within the electronics industry. Our product has been exported to Canada, Lithuania, Kazakhstan, Colombia, Argentina, and other countries. Furthermore, we are seeking agents on a global scale. Welcome to contact us, if you are interested in our product.
Scope of Application:
Product Details:
Brand | Jufeng |
Usage/Application | Industrial |
Weight | 500 gm |
Model Name/Number | Sn42Bi57Ag1 |
Melting Point | 138 Deg C |
Reference Working Temperature | 160-175 Deg C |
The Sn42Bi57Ag1 low temperature solder paste is a standard type of low-temperature silver solder paste. It offers great soldering performance, good electrical conductivity, and fatigue resistance that results in a high-quality solder.
Solder paste is commonly applied in the PCB industry for soft soldering sheet metal, lead tube, electric cables, radiators, bulbs, heating components of TVs, SMT reflow soldering, and other operations.
Product Details:
Minimum Order Quantity | 500 Piece |
Usage/Application | For Soldering |
Physical State | Solid |
Weight | As required |
Country of Origin | Made in India |
Brand name | Solder Preform |
Solder Preforms come in standard shapes such as squares, rectangles, washers and discs. Customized shape can be available upon request.
Alloy Options Au80Sn20Application Examples
The solder preforms are used in a variety of applications such as: Die attach of semiconductor, LED and laser chips, thermal fuses, sealing, thermal interface, connectors and cables, vacuum and hermetic seals and gaskets, PCB assembly, mechanical attachment, package/lid sealing.
Quality Control
Additional Information: