Jufeng Solder International Private Limited
Sector 62, Noida, Gautam Buddha Nagar, Uttar Pradesh
GST No. 09AAECJ5474C2ZI
TrustSEAL Verified
Call 0804827498186% Response Rate
SEND EMAIL

Solder Paste

Our product range includes a wide range of sn63pb37 mid temperature tin lead solder paste for pcb, sn96.5ag3.0cu0.5 sac305 lead free silver solder paste, sn99ag0.3cu0.7 high temperature smt lead free solder paste, sn64bi35ag1 mid temperature lead free solder paste, sn42bi58 low temperature lead free solder paste for led and sn62.8pb36.8ag0.4 middle temperature solder paste.

Sn63Pb37 Mid Temperature Tin Lead Solder Paste for PCB

Sn63Pb37 Mid Temperature Tin Lead Solder Paste for PCB
  • Sn63Pb37 Mid Temperature Tin Lead Solder Paste for PCB
  • Sn63Pb37 Mid Temperature Tin Lead Solder Paste for PCB
  • Sn63Pb37 Mid Temperature Tin Lead Solder Paste for PCB
  • Sn63Pb37 Mid Temperature Tin Lead Solder Paste for PCB
Get Best Quote
Approx. Price: Rs 2,300 / KgGet Latest Price

Product Details:

Usage/ApplicationIndustrial
Gravity8.60 g/cm3
ModelSn63Pb37
Melting Point183 Deg C
BrandJufeng
AppearanceAdhesive Paste In Grayish Black
Tensile Strength51.3 MPa
Weight500g/bottle, 10kg/box
Country of OriginMade in India

The Sn63Pb37 for PCB is a classic type of mid temperature tin lead solder paste. Its alloy comprises the 63% tin content and the 37% lead content. Its working temperature falls into the preheat temperature from 90 to 150 the melting point of 183 and the reflow temperature range from 190 to 100 This product is suitable for the highly demanding reflow-soldering process.


As one of the leaded series products developed by our company, the solder paste 63/37 can offer extremely good soldering effect. It has been exported to India, Russia, and other countries. Moreover, we are looking for agents around the world.


Applications:

  • The Sn63Pb37 mid-temperature leaded solder paste is applicable for the LED circuit boards, diversified lighting fixtures, computer motherboards, phone motherboards, printed circuit boards, surface mount devices, as well as all kinds of high-precision circuit boards.

Features:

  • With superb fluidity and nice soldering effect, our product can accomplish the exquisite printing of the pad, the separation distance of which can be only 0.3mm.
  • There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 8 hours of operation of the steel mesh. Moreover, our product can still maintain the favorable and continuous printing effect.
  • The original shape will not be changed after several hours of printing process. In addition, the surface mount assembly will not be affected.
  • Beyond that, our Sn63Pb37 mid temperature tin lead solder paste for PCB can give favorable wetting property on the substrate made from different materials.
  • Owing to its wonderful soldering performance, this product will not produce any tiny solder bead after the soldering process is completed.

Chemical Components:
TypeChemical Composition (wt. %)
SnPbSbCuBiZnFeAlCd
Sn63Pb3763±0.5Residue Content< 0.2< 0.08< 0.1< 0.001< 0.02< 0.001< 0.002


Preservation Method:

  • The Sn63Pb37 mid temperature tin lead solder paste for PCB had better be stored at a temperature range from zero to 10???. The service life of the unsealed product is 6 months. Furthermore, our product can not be exposed to sunshine.
Request
Callback
Yes! I am Interested

Sn96.5Ag3.0Cu0.5 SAC305 Lead Free Silver Solder Paste

Sn96.5Ag3.0Cu0.5 SAC305 Lead Free Silver Solder Paste
  • Sn96.5Ag3.0Cu0.5 SAC305 Lead Free Silver Solder Paste
  • Sn96.5Ag3.0Cu0.5 SAC305 Lead Free Silver Solder Paste
  • Sn96.5Ag3.0Cu0.5 SAC305 Lead Free Silver Solder Paste
  • Sn96.5Ag3.0Cu0.5 SAC305 Lead Free Silver Solder Paste
Get Best Quote
Approx. Price: Rs 6,300 / KgGet Latest Price

Product Details:

Usage/ApplicationIndustrial
BrandJufeng
Weight500g/bottle, 10kg/box
Model Name/NumberSn96.5Ag3.0Cu0.5 SAC305
Tensile Strength53.3 MPa
AppearanceAdhesive paste in grayish black
Melting Point217-219 Deg C
Specific Gravity7.40 g/cm3

Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste adopts the alloy which is formed by the 96.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 130 degrees Celsius to 170 degrees Celsius. The melting temperature is 217 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.


The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. Moreover, we are looking for agents on a global scale. Please contact us, if you show interest in our product.


Chemical Component Data Sheet:

TypeChemical Composition (wt. %)
SnPbSbCuAgFeAlCd
Sn96.5Ag0.3Cu0.5Bal< 0.1< 0.10.5±0.23.0±0.2< 0.02< 0.001< 0.002

Physical Properties:

TypeMelting Point, ???Specific Gravity, g/cm3Tensile Strength, MPa
Sn96.5-Ag3.0-Cu0.5217-2197.4053.3

Main Specifications:

SpecificationSn99-Ag3.0-Cu0.5
AppearanceAdhesive paste in grayish black
Weight500g/bottle, 10kg/box
Request
Callback
Yes! I am Interested

Sn99Ag0.3Cu0.7 High Temperature SMT Lead Free Solder Paste

Sn99Ag0.3Cu0.7 High Temperature SMT Lead Free Solder Paste
  • Sn99Ag0.3Cu0.7 High Temperature SMT Lead Free Solder Paste
  • Sn99Ag0.3Cu0.7 High Temperature SMT Lead Free Solder Paste
  • Sn99Ag0.3Cu0.7 High Temperature SMT Lead Free Solder Paste
  • Sn99Ag0.3Cu0.7 High Temperature SMT Lead Free Solder Paste
Get Best Quote
Approx. Price: Rs 4,000 / PieceGet Latest Price

Product Details:

Usage/ApplicationIndustrial
Packaging TypeBottle
BrandJufeng
ModelSn99Ag0.3Cu0.7
AppearanceAdhesive paste in grayish black
Weight500g/bottle, 10kg/box

The Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste puts to use the alloy, comprising the 99% tin, the 0.3% lead and the 0.7% copper. With the melting point of 227 degrees Celsius, this product is fit for the reflow soldering process which has relatively high demand. Its preheat temperature ranges from 130 degrees Celsius to 170 degrees Celsius. Its reflow temperature varies from 280 degrees Celsius to 200 degrees Celsius.


In addition, the flux contained in our Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste takes advantage of the highly reliable low-ion type halogen activator. In other words, our product features extremely high reliability, even if it is not cleaned after the reflow soldering process.


The no-clean type lead free solder cream is applicable for the electronic PCB and SMT. There is no need to clean our product with other chemical agent. This product can be spread on the circuit board automatically, which offers much convenience and environmental protection.

Chemical Composition:

Type Chemical Composition (wt. %)
Sn Pb Sb Cu Ag Fe Al Cd
Sn99Ag0.3Cu0.7 Bal < 0.1 < 0.1 0.7±0.2 0.3±0.1 < 0.02 < 0.001 < 0.002


Applications:

  • Our Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste is ideal for use in the precise computer motherboards, phone motherboards, printed circuit boards (PCB), as well as a variety of high-precision electronic circuit boards. It is dedicated for the LED, SMT, electronic mount technology, and the plug-in components.


Packing:

  • The Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste can be classified as the bottle packing type and the syringe packing type. Each bottle holds the solder cream of 500g, and each syringe can load the solder cream of 100g.
  • The packaging material can be separated into the inner layer of a bubble box and the outer layer of a carton, so as to better secure the transportation.
  • The dimension of each carton is 34.5*27.5*23.5cm (length*width*height). The gross weight is 10kg.
  • The minimum order quantity, abbreviated as MOQ, is 50kg.
  • The OEM service is available. We can produce the logo of our customers, and the specific price is negotiable.
  • Our production capacity for the lead free solder wire is 80 tons per month.
Request
Callback
Yes! I am Interested

Sn64Bi35Ag1 Mid Temperature Lead Free Solder Paste

Sn64Bi35Ag1 Mid Temperature Lead Free Solder Paste
  • Sn64Bi35Ag1 Mid Temperature Lead Free Solder Paste
  • Sn64Bi35Ag1 Mid Temperature Lead Free Solder Paste
  • Sn64Bi35Ag1 Mid Temperature Lead Free Solder Paste
  • Sn64Bi35Ag1 Mid Temperature Lead Free Solder Paste
Get Best Quote
Approx. Price: Rs 4,200 / KgGet Latest Price

Product Details:

BrandJufeng
Usage/ApplicationIndustrial
Model Name/NumberSn64Bi35Ag1
Packaging TypeBottle
Preheat Temperature110 to 160 degrees Celsius
Reflow Temperature210 to 150 degrees Celsius
Country of OriginMade in India

The Sn64Bi35Ag1 mid temperature lead free solder paste indicates that the alloy consists of the 64% tin content, the 35% bismuth content, and the 1% silver content. Its operating temperature can be divided into the preheat temperature from 110 degrees Celsius to 160 degrees Celsius, the melting point of 189 degrees Celsius, and the reflow temperature from 210 degrees Celsius to 150 degrees Celsius. This product is desirable for the reflow soldering process which has relatively high demand.


Moreover, the 1% silver content is doped with the active bismuth, which allows this type of tin paste to be applicable for the low or medium temperature type electrical equipment sets. Owing to the outstanding wetting property and soldering performance, this Sn64Bi35Ag1 mid temperature lead free solder paste is particularly suitable for the welding of circuit boards.


Applications:

  • Our Sn64Bi35Ag1 mid temperature lead free solder paste can be used in the LED circuit boards, various lamps, computer motherboards, phone motherboards, printed circuit boards, surface mount technology, as well as all kinds of high-precision circuit boards.

Technical Parameters:

Heating RateTime Required for Reaching 110ºCConstant Temperature
110 - 138ºC
Peak Temperature210±10???Cooling Rate
1-3 ºC/sec< 60-90 seconds60-100 seconds175 ±5ºC30-60 seconds< 4ºC / S

Storage, Operation and Storage Life:

  • Once receiving the Sn64Bi35Ag1 mid temperature lead free solder paste, our clients had better put this product into a refrigerator for storage. We suggest that the solder cream should be kept in cold storage at a temperature range from 2 degrees Celsius to 8 degrees Celsius. The warranty period is 6 months from the date of production. Moreover, our cargo should conform to the First in First out principle.
  • The solder paste needs to be kept at a room temperature before being used. The recommended time is 4 hours. After the temperature recovery, the storage life reaches 48 hours. Once the Sn64Bi35Ag1 mid temperature lead free solder paste is unsealed, the storage life will be 12 hours. It takes 100±20 minutes to make the solder paste stay on the printed circuit board before the reflow soldering process starts.
  • The residual solder cream is not allowed to be mixed with the new solder cream in one bottle.

Technical Data Sheet:

TypeChemical Composition (wt. %)
SnBiAgPbFeAlCd
Sn64-Bi35-Ag164±0.535±0.51±0.5< 0.01< 0.02< 0.001< 0.002


Established in 2006, Jufeng Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. With over a decade of experience in the soldering industry, we mainly supply a variety of solder wire, solder bar, solder paste, solder powder, flux, and the soldering machines, among others.

Request
Callback
Yes! I am Interested

Sn42bi58 Low Temperature Lead Free Solder Paste For Led

Sn42bi58 Low Temperature Lead Free Solder Paste For Led
  • Sn42bi58 Low Temperature Lead Free Solder Paste For Led
  • Sn42bi58 Low Temperature Lead Free Solder Paste For Led
  • Sn42bi58 Low Temperature Lead Free Solder Paste For Led
  • Sn42bi58 Low Temperature Lead Free Solder Paste For Led
Get Best Quote
Approx. Price: Rs 400 / PieceGet Latest Price

Product Details:

BrandJufeng
Model Name/NumberSn42Bi58
Weight500g/bottle, 10kg/box
Usage/ApplicationIndustrial
AppearanceAdhesive paste in grayish black
Preheat Temperature90 to 110 Deg C
Reflow Temperature150 to 100 Deg C

Our Sn42Bi58 for LED is a typical type of low-temperature lead free solder paste. Its alloy is made up of the 42% tin content and the 58% bismuth content. Its working temperature can be categorized into the preheat temperature from 90??? to 110???, the melting point of 138???, and the reflow temperature from 150??? to 100???. It is fit for the demanding reflow-soldering process.


This type of product has passed the SGS test. It also holds numerous certifications, such as RoHS, REACH, and some others. Additionally, it is accompanied with the related material safety data sheet, abbreviated as MSDS. The Sn42Bi58 low temperature lead free solder paste for LED has been exported to such countries as Pakistan, Iran, Colombia, Italy, Spain, Ukraine, Mexico, and more.


Uses:

  • Our Sn42Bi58 lead free solder paste is the best choice of repairing the mini-sized electronic equipment. It is also ideal for use in the PCB, SMT, plug-in components, computer motherboards, phone motherboards, LED circuit boards, diversified lighting fixtures, as well as all sorts of high-precision circuit boards.  

Chemical Component:
TypeChemical Composition (wt. %)
SnBiSbPbFeAlCd
Sn42Bi5842±0.158±0.5< 0.1< 0.1< 0.02< 0.001< 0.002

Technical Issues and Solutions:

  • Missing Print: The solder cream is not printed on the area that is more than 25% larger than that of the PAD.
  • The mesh may be blocked, or part of the solder cream is adhered to the bottom of the steel mesh. In this case, the bottom of the steel mesh must be cleaned, and the stripping speed is decreased.
  • The steel mesh is short of solder cream, or the tin paste is not well distributed along the direction of width of the scraper. Under the circumstance, the solder cream should be added along the direction of width of the scraper.
  • The viscosity of the solder cream is too high, and the printing effect is not desirable. In this case, the tin paste supplier is requested to provide the solvent. Additionally, please select the proper viscosity of Sn42Bi58 low temperature lead free solder paste for LED.
Request
Callback
Yes! I am Interested

Sn62.8Pb36.8Ag0.4 Middle Temperature Solder Paste

Sn62.8Pb36.8Ag0.4 Middle Temperature Solder Paste
  • Sn62.8Pb36.8Ag0.4 Middle Temperature Solder Paste
  • Sn62.8Pb36.8Ag0.4 Middle Temperature Solder Paste
  • Sn62.8Pb36.8Ag0.4 Middle Temperature Solder Paste
  • Sn62.8Pb36.8Ag0.4 Middle Temperature Solder Paste
Get Best Quote
Approx. Price: Rs 3,800 / kgGet Latest Price

Product Details:

Minimum Order Quantity50 kg
Packaging Size500 gm
Usage/ApplicationIndustrial
Physical StateLiquid
BrandJufeng
Model Name/NumberSn62.8Pb36.8Ag0.4
Packaging TypeBottle
Country of OriginMade in India

The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made up of 62.8% tin, 36.8% lead, and 0.4% silver content.


This kind of solder paste is a no-clean type solder cream designed for SMT production processes. It is made from special flux and tin spherical powder with few oxide contents. The paste maintains its viscosity allowing for a high level continuous printing effect. In addition, the flux contained in our Sn62.8Pb36.8Ag0.4 solder paste takes advantages of the high reliable low-ion type halogen activator. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.


Features:

  • With nice fluidity and good soldering effect, the solder paste can accomplish the precision printing of circuit components, the separation distance of which can be only 0.2mm.
  • There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 12 hours of operation of the steel mesh.
  • The original shape will not be changed after several hours of printing. In addition, the surface mount assembly will not be affected.
  • Favorable wetting property on the substrate made from different materials.
  • It can adapt to the requirements of multiple grades of welding equipment. It operates well without a nitrogen-filled environment or in a wide furnace temperature range for reflow soldering.
  • Excellent welding performance during “heating then preservation” and “gradually heating” furnace settings.
  • There is a special designed solder paste for BGA chip carrier, which can solve the problem of BGA welding.
  • Good ICT test performance.
  • It can be used for paste in hole processes.

Technical features of solder paste:

1. Main standards and methods for quality control

  • ANSI/J-STD-004/005/006;
  • JIS Z 3197-86;
  • JIS Z 3283-86;
  • IPC-TM-650.
2. Features of tin alloy powder
Alloy composition
Composition Content %
Sn % 62.8±0.5
Ag % 0.4±0.1
Pb % Remainder
Cu % ≤0.005
Bi % ≤0.03
Fe % ≤0.02
As % ≤0.01
Ag % ≤0.05
Zn % ≤0.002
Al % ≤0.001
Pb % ≤0.05
Cd % ≤0.002
Sb % ≤0.002
Request
Callback
Yes! I am Interested

Solder paste Empty Jar

Solder paste Empty Jar
  • Solder paste Empty Jar
  • Solder paste Empty Jar
  • Solder paste Empty Jar
  • Solder paste Empty Jar
  • Solder paste Empty Jar
  • Solder paste Empty Jar
  • Solder paste Empty Jar
Get Best Quote
Approx. Price: Rs 28 / PieceGet Latest Price

Product Details:

Minimum Order Quantity300 Piece
Packaging Size500 gm
Usage/ApplicationFor Soldering
Physical StateSolid
Weight45G
DimensionsDia58*H70mm
Model Name/NumberJF-SPB001
Country of OriginMade in India

1) Excellent sealing for better storage of solder paste
2) Made of food grade PP material, RoHS compliant
3) Can be customized with logo and colour
4) Thicker can body, resistant to pressure, extrusion and abrasion
5) In stock and OEM service available
Request
Callback


Additional Information:

  • Item Code: JF-SPB001
  • Production Capacity: 1000000
  • Delivery Time: 15days
  • Packaging Details: 300pieces/cart-on
Yes! I am Interested

Solder Paste Empty Jar

Solder Paste Empty Jar
  • Solder Paste Empty Jar
  • Solder Paste Empty Jar
  • Solder Paste Empty Jar
  • Solder Paste Empty Jar
  • Solder Paste Empty Jar
  • Solder Paste Empty Jar
Get Best Quote
Approx. Price: Rs 28 / PieceGet Latest Price

Product Details:

Minimum Order Quantity300 Piece
Packaging Size500 gm
Usage/ApplicationFor Soldering
Physical StateSolid
Weight45G
DimensionsDia58*H70mm
Model Name/NumberJF-SPB002
Country of OriginMade in India

1) Excellent sealing for better storage of solder paste
2) Made of food grade PP material, RoHS compliant
3) Can be customized with logo and colour
4) Thicker can body, resistant to pressure, extrusion and abrasion
5) In stock and OEM service available
Request
Callback


Additional Information:

  • Item Code: JF-SPB002
  • Production Capacity: 1000000
  • Delivery Time: 15days
  • Packaging Details: 300pieces/cart-on
Yes! I am Interested

Sn42Bi58 Low Temperature Solder Paste

Sn42Bi58 Low Temperature Solder Paste
  • Sn42Bi58 Low Temperature Solder Paste
  • Sn42Bi58 Low Temperature Solder Paste
Get Best Quote
Approx. Price: Rs 3,000 / KgGet Latest Price

Product Details:

Physical StateSolid
BrandJufeng
Usage/ApplicationIndustrial
Weight500g/bottle, 10kg/box
Model Name/NumberSn42Bi58
Melting Point138 Deg CV
Tensile Strength22HB Mpa
AppearanceAdhesive Paste In Grayish Black
Gravity8.6 g/cm3
Country of OriginMade in India

The Sn42Bi58 is a common lead free solder paste with an alloy composed of 42% tin and 58% bismuth. It has a preheat temperature from 90??? to 110???, melting point of 138???, and the reflow temperature range from 150??? to 100???. It is suitable for the demanding reflow-soldering process.


The activated flux in this product delivers superior fluxing effects. The solder paste was developed for soldering electrical devices at low temperatures. With good wetting properties and soldering performance, it is commonly used for soldering LED circuit boards.


This type of product has passed SGS tests and also holds numerous certifications, such as RoHS and REACH. It is also accompanied with the related material safety data sheet and abrasives as MSDS. The Sn42Bi58 Low temperature solder paste has been exported to such countries as Pakistan, Iran, Colombia, Italy, Spain, Ukraine, Mexico, etc. What’s more, we are seeking agents on a global scale. Please don’t hesitate to contact us if you are interested in our products.


Application:

  • Ideal for use in PCB, SMT, plug-in components, computer motherboards, phone motherboards, LED circuit boards, diversified lighting fixtures, as well as all sorts of high-precision circuit boards.
  • Optimal choice for repairing small electronic equipment.
  • Suitable for lead-free hot tin dipping and the soldering of various components.
  • Can be used for multiple special soldering techniques.

Features:
  • With nice fluidity and good soldering effect, the solder paste can accomplish the exquisite printing of circuit components, the separation distance of which can be only 0.3mm.
  • There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 8 hours of operation of the steel mesh.
  • The original shape will not be changed after several hours of printing process. In addition, the surface mount assembly will not be affected.
  • Favorable wetting property on the substrate made from different materials. Thanks to good soldering performance, it performs well on all kinds of coating surfaces.
  • With excellent fine pitch printing capability, it can successfully operate reflow soldering in air or in helium. It features high reliability, even if it is not cleaned after the reflow soldering process.
  • Made of lead-free alloy with little oxidation and activated flux, its viscosity suits printing and dispensing processes.

Chemistry component:

TypeChemical composition (wt.%)
SnBiSbPbFeAlCd
Sn42-Bi5842±0.558±0.5< 0.02< 0.01< 0.02< 0.002< 0.003

Standard Paste Composition:
ApplicationTypeDiameterContent
Standard printingAlloy powder 325~45 μm89 %
Fine pitch printingAlloy powder 420~38 μm88.5 %
InstillAlloy powder 325~45 μm85 %

Recommended process parameters:

Temperature rise speedThe time taken to get to 110 ???Constant temperature of 110 – 138 ???Peak temperature> 138???Cooling speed
1-3 ???/sec< 60-90 sec60-100 sec175±5 ???< 30-60 sec< 4 ???/sec
Request
Callback
Yes! I am Interested

Sn42Bi57Ag1 Low Temperature Solder Paste

Sn42Bi57Ag1 Low Temperature Solder Paste
  • Sn42Bi57Ag1 Low Temperature Solder Paste
Get Best Quote
Approx. Price: Rs 4,000 / KgGet Latest Price

Product Details:

BrandJufeng
Usage/ApplicationIndustrial
Weight500 gm
Model Name/NumberSn42Bi57Ag1
Melting Point138 Deg C
Reference Working Temperature160-175 Deg C

The Sn42Bi57Ag1 low temperature solder paste is a standard type of low-temperature silver solder paste. It offers great soldering performance, good electrical conductivity, and fatigue resistance that results in a high-quality solder.


Solder paste is commonly applied in the PCB industry for soft soldering sheet metal, lead tube, electric cables, radiators, bulbs, heating components of TVs, SMT reflow soldering, and other operations. 

Request
Callback
Yes! I am Interested

Sn62Pb36Ag2 Mid Temperature Tin Lead Solder Paste

Sn62Pb36Ag2 Mid Temperature Tin Lead Solder Paste
  • Sn62Pb36Ag2 Mid Temperature Tin Lead Solder Paste
Get Best Quote
Approx. Price: Rs 2,400 / KgGet Latest Price

Product Details:

Minimum Order Quantity10 Kg
Usage/ApplicationIndustrial
AppearanceAdhesive Paste In Grayish Black
Weight500g/bottle, 10kg/box
Preheat Temperature90 to 150 Deg C
Reflow Temperature190 to 100 Deg C
BrandJufeng
ModelSn62Pb36Ag2
Packaging TypeBottle
Melting Temperature183 Deg C
Country of OriginMade in India

Our Sn62Pb36Ag2 is a type of mid temperature tin lead solder paste. It means that the alloy is formed by the 62% tin content, the 36% lead content, and the 2% silver content. Its working temperature can be classified as the preheat temperature from 90??? to 150???, the melting temperature of 183???, and the reflow temperature from 190??? to 100???. Therefore, this product is suitable for the highly demanding reflow-soldering work.


The Sn62Pb36Ag2 solder paste is one of the leaded products developed by our company. It conforms to the surface mount technology within the electronics industry. Our product has been exported to Canada, Lithuania, Kazakhstan, Colombia, Argentina, and other countries. Furthermore, we are seeking agents on a global scale. Welcome to contact us, if you are interested in our product.


Scope of Application:

  • This Sn62Pb36Ag2 mid-temperature leaded solder paste is ideal for use in the PCB, SMT, LED circuit boards, various lighting fixtures, computer motherboards, phone motherboards, and a variety of precise circuit boards.

Prominent Characteristics:

  • Our Sn62Pb36 mid temperature tin lead solder paste features extremely good weldability. It can offer nice wetting property on the substrate made from different materials.
  • The original shape will keep unchanged even after several hours of the printing process. Additionally, the surface mount assembly will not be affected.
  • The viscosity is rarely changed during the continuous printing process. Also, it will not be altered, even after 8 hours of operation of the steel mesh. Moreover, our product can still maintain the favorable and continuous printing effect.
  • Thanks to superb fluidity and nice soldering effect, our product can accomplish the exquisite printing of the pad, the separation distance of which can be only 0.3mm.
Request
Callback
Yes! I am Interested

Sn63Pb37 Solder Preform

Sn63Pb37 Solder Preform
  • Sn63Pb37 Solder Preform
  • Sn63Pb37 Solder Preform
  • Sn63Pb37 Solder Preform
  • Sn63Pb37 Solder Preform
  • Sn63Pb37 Solder Preform
  • Sn63Pb37 Solder Preform
Get Best Quote
Approx. Price: Rs 45 / PieceGet Latest Price

Product Details:

Minimum Order Quantity500 Piece
Usage/ApplicationFor Soldering
Physical StateSolid
WeightAs required
Brand nameSolder Preform
Country of OriginMade in India

Solder Preforms come in standard shapes such as squares, rectangles, washers and discs. Customized shape can be available upon request.

Alloy Options Au80Sn20
Au88Ge12
Au10Sn90
Au80Cu20
Ag72Cu28
AgCu30Sn10SAC305???Sn96.5Ag3.0Cu0.5)
SAC405???Sn95.5Ag4.0Cu0.5)
Sn98.5Ag1.0Cu0.5
Sn63Pb37
Sn90Sb10
Sn96.5Ag3.5In52Sn48
In97Ag3
In100
Pb92.5Sn5Ag2.5
Bi58Sn42
Bi57Sn42Ag1Solder Preform Alloy

Application Examples
The solder preforms are used in a variety of applications such as: Die attach of semiconductor, LED and laser chips, thermal fuses, sealing, thermal interface, connectors and cables, vacuum and hermetic seals and gaskets, PCB assembly, mechanical attachment, package/lid sealing.

Quality Control

  • Management system: ISO 9001, IATF16949
  • Uses high purity raw material (Tin - 5N, gold and silver - 4N )
  • Has strict control on using times of raw materials
  • Composition and melting point testing must be performed on each batch of products.
  • Random inspection according to the standards of GB/T2828S-3
      Dimensional inspection
      100% appearance inspection
      Performance inspection: oxidation, ductility, soldering
  • Performs strict quality control on the sample, the first finished product and final product.
Request
Callback


Additional Information:

  • Production Capacity: 10000
  • Delivery Time: 2-3 weeks
  • Packaging Details: Box
Yes! I am Interested
X

Explore More Products

View All Products




Reach Us
Sunil Kumar (Sales Manager)
Jufeng Solder International Private Limited
H-97,Sector-63, Gautam Buddha nagar
Noida - 201301, Gautam Buddha Nagar, Uttar Pradesh, India


Call Us


Send E-mail