Solder Paste

Product Details:

Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste adopts the alloy which is formed by the 96.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 130 degrees Celsius to 170 degrees Celsius. The melting temperature is 217 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.

The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. Moreover, we are looking for agents on a global scale. Please contact us, if you show interest in our product.

Product Details:

The Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste puts to use the alloy, comprising the 99% tin, the 0.3% lead and the 0.7% copper. With the melting point of 227 degrees Celsius, this product is fit for the reflow soldering process which has relatively high demand. Its preheat temperature ranges from 130 degrees Celsius to 170 degrees Celsius. Its reflow temperature varies from 280 degrees Celsius to 200 degrees Celsius.

In addition, the flux contained in our Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste takes advantage of the highly reliable low-ion type halogen activator. In other words, our product features extremely high reliability, even if it is not cleaned after the reflow soldering process.

The no-clean type lead free solder cream is applicable for the electronic PCB and SMT. There is no need to clean our product with other chemical agent. This product can be spread on the circuit board automatically, which offers much convenience and environmental protection.

Chemical Composition:

Applications:

• Our Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste is ideal for use in the precise computer motherboards, phone motherboards, printed circuit boards (PCB), as well as a variety of high-precision electronic circuit boards. It is dedicated for the LED, SMT, electronic mount technology, and the plug-in components.

Packing:

• The Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste can be classified as the bottle packing type and the syringe packing type. Each bottle holds the solder cream of 500g, and each syringe can load the solder cream of 100g.
• The packaging material can be separated into the inner layer of a bubble box and the outer layer of a carton, so as to better secure the transportation.
• The dimension of each carton is 34.5*27.5*23.5cm (length*width*height). The gross weight is 10kg.
• The minimum order quantity, abbreviated as MOQ, is 50kg.
• The OEM service is available. We can produce the logo of our customers, and the specific price is negotiable.
• Our production capacity for the lead free solder wire is 80 tons per month.

Product Details:

The Sn64Bi35Ag1 mid temperature lead free solder paste indicates that the alloy consists of the 64% tin content, the 35% bismuth content, and the 1% silver content. Its operating temperature can be divided into the preheat temperature from 110 degrees Celsius to 160 degrees Celsius, the melting point of 189 degrees Celsius, and the reflow temperature from 210 degrees Celsius to 150 degrees Celsius. This product is desirable for the reflow soldering process which has relatively high demand.

Moreover, the 1% silver content is doped with the active bismuth, which allows this type of tin paste to be applicable for the low or medium temperature type electrical equipment sets. Owing to the outstanding wetting property and soldering performance, this Sn64Bi35Ag1 mid temperature lead free solder paste is particularly suitable for the welding of circuit boards.

Applications:

• Our Sn64Bi35Ag1 mid temperature lead free solder paste can be used in the LED circuit boards, various lamps, computer motherboards, phone motherboards, printed circuit boards, surface mount technology, as well as all kinds of high-precision circuit boards.

• Once receiving the Sn64Bi35Ag1 mid temperature lead free solder paste, our clients had better put this product into a refrigerator for storage. We suggest that the solder cream should be kept in cold storage at a temperature range from 2 degrees Celsius to 8 degrees Celsius. The warranty period is 6 months from the date of production. Moreover, our cargo should conform to the First in First out principle.
• The solder paste needs to be kept at a room temperature before being used. The recommended time is 4 hours. After the temperature recovery, the storage life reaches 48 hours. Once the Sn64Bi35Ag1 mid temperature lead free solder paste is unsealed, the storage life will be 12 hours. It takes 100±20 minutes to make the solder paste stay on the printed circuit board before the reflow soldering process starts.
• The residual solder cream is not allowed to be mixed with the new solder cream in one bottle.

Established in 2006, Jufeng Solder Co., Ltd. is specialized in the R&D, production and sales of solder products. With over a decade of experience in the soldering industry, we mainly supply a variety of solder wire, solder bar, solder paste, solder powder, flux, and the soldering machines, among others.

Product Details:

Our Sn42Bi58 for LED is a typical type of low-temperature lead free solder paste. Its alloy is made up of the 42% tin content and the 58% bismuth content. Its working temperature can be categorized into the preheat temperature from 90??? to 110???, the melting point of 138???, and the reflow temperature from 150??? to 100???. It is fit for the demanding reflow-soldering process.

This type of product has passed the SGS test. It also holds numerous certifications, such as RoHS, REACH, and some others. Additionally, it is accompanied with the related material safety data sheet, abbreviated as MSDS. The Sn42Bi58 low temperature lead free solder paste for LED has been exported to such countries as Pakistan, Iran, Colombia, Italy, Spain, Ukraine, Mexico, and more.

Uses:

• Our Sn42Bi58 lead free solder paste is the best choice of repairing the mini-sized electronic equipment. It is also ideal for use in the PCB, SMT, plug-in components, computer motherboards, phone motherboards, LED circuit boards, diversified lighting fixtures, as well as all sorts of high-precision circuit boards.  

• Missing Print: The solder cream is not printed on the area that is more than 25% larger than that of the PAD.
• The mesh may be blocked, or part of the solder cream is adhered to the bottom of the steel mesh. In this case, the bottom of the steel mesh must be cleaned, and the stripping speed is decreased.
• The steel mesh is short of solder cream, or the tin paste is not well distributed along the direction of width of the scraper. Under the circumstance, the solder cream should be added along the direction of width of the scraper.
• The viscosity of the solder cream is too high, and the printing effect is not desirable. In this case, the tin paste supplier is requested to provide the solvent. Additionally, please select the proper viscosity of Sn42Bi58 low temperature lead free solder paste for LED.

Product Details:

The Sn63Pb37 for PCB is a classic type of mid temperature tin lead solder paste. Its alloy comprises the 63% tin content and the 37% lead content. Its working temperature falls into the preheat temperature from 90 to 150 the melting point of 183 and the reflow temperature range from 190 to 100 This product is suitable for the highly demanding reflow-soldering process.

As one of the leaded series products developed by our company, the solder paste 63/37 can offer extremely good soldering effect. It has been exported to India, Russia, and other countries. Moreover, we are looking for agents around the world.

Applications:

• The Sn63Pb37 mid-temperature leaded solder paste is applicable for the LED circuit boards, diversified lighting fixtures, computer motherboards, phone motherboards, printed circuit boards, surface mount devices, as well as all kinds of high-precision circuit boards.

• With superb fluidity and nice soldering effect, our product can accomplish the exquisite printing of the pad, the separation distance of which can be only 0.3mm.
• There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 8 hours of operation of the steel mesh. Moreover, our product can still maintain the favorable and continuous printing effect.
• The original shape will not be changed after several hours of printing process. In addition, the surface mount assembly will not be affected.
• Beyond that, our Sn63Pb37 mid temperature tin lead solder paste for PCB can give favorable wetting property on the substrate made from different materials.
• Owing to its wonderful soldering performance, this product will not produce any tiny solder bead after the soldering process is completed.

Preservation Method:

• The Sn63Pb37 mid temperature tin lead solder paste for PCB had better be stored at a temperature range from zero to 10???. The service life of the unsealed product is 6 months. Furthermore, our product can not be exposed to sunshine.

Product Details:

The Sn62.8Pb36.8Ag0.4 is a mid temperature tin lead solder paste. Its alloy is made up of 62.8% tin, 36.8% lead, and 0.4% silver content.

This kind of solder paste is a no-clean type solder cream designed for SMT production processes. It is made from special flux and tin spherical powder with few oxide contents. The paste maintains its viscosity allowing for a high level continuous printing effect. In addition, the flux contained in our Sn62.8Pb36.8Ag0.4 solder paste takes advantages of the high reliable low-ion type halogen activator. After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.

• With nice fluidity and good soldering effect, the solder paste can accomplish the precision printing of circuit components, the separation distance of which can be only 0.2mm.
• There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 12 hours of operation of the steel mesh.
• The original shape will not be changed after several hours of printing. In addition, the surface mount assembly will not be affected.
• Favorable wetting property on the substrate made from different materials.
• It can adapt to the requirements of multiple grades of welding equipment. It operates well without a nitrogen-filled environment or in a wide furnace temperature range for reflow soldering.
• Excellent welding performance during “heating then preservation” and “gradually heating” furnace settings.
• There is a special designed solder paste for BGA chip carrier, which can solve the problem of BGA welding.
• Good ICT test performance.
• It can be used for paste in hole processes.

1. Main standards and methods for quality control

• ANSI/J-STD-004/005/006;
• JIS Z 3197-86;
• JIS Z 3283-86;
• IPC-TM-650.

Product Details:

Additional Information:

• Item Code: JF-SPB001
• Production Capacity: 1000000
• Delivery Time: 15days
• Packaging Details: 300pieces/cart-on

Product Details:

Additional Information:

• Item Code: JF-SPB002
• Production Capacity: 1000000
• Delivery Time: 15days
• Packaging Details: 300pieces/cart-on

Product Details:

The Sn42Bi58 is a common lead free solder paste with an alloy composed of 42% tin and 58% bismuth. It has a preheat temperature from 90??? to 110???, melting point of 138???, and the reflow temperature range from 150??? to 100???. It is suitable for the demanding reflow-soldering process.

The activated flux in this product delivers superior fluxing effects. The solder paste was developed for soldering electrical devices at low temperatures. With good wetting properties and soldering performance, it is commonly used for soldering LED circuit boards.

This type of product has passed SGS tests and also holds numerous certifications, such as RoHS and REACH. It is also accompanied with the related material safety data sheet and abrasives as MSDS. The Sn42Bi58 Low temperature solder paste has been exported to such countries as Pakistan, Iran, Colombia, Italy, Spain, Ukraine, Mexico, etc. What’s more, we are seeking agents on a global scale. Please don’t hesitate to contact us if you are interested in our products.

• Ideal for use in PCB, SMT, plug-in components, computer motherboards, phone motherboards, LED circuit boards, diversified lighting fixtures, as well as all sorts of high-precision circuit boards.
• Optimal choice for repairing small electronic equipment.
• Suitable for lead-free hot tin dipping and the soldering of various components.
• Can be used for multiple special soldering techniques.

• With nice fluidity and good soldering effect, the solder paste can accomplish the exquisite printing of circuit components, the separation distance of which can be only 0.3mm.
• There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 8 hours of operation of the steel mesh.
• The original shape will not be changed after several hours of printing process. In addition, the surface mount assembly will not be affected.
• Favorable wetting property on the substrate made from different materials. Thanks to good soldering performance, it performs well on all kinds of coating surfaces.
• With excellent fine pitch printing capability, it can successfully operate reflow soldering in air or in helium. It features high reliability, even if it is not cleaned after the reflow soldering process.
• Made of lead-free alloy with little oxidation and activated flux, its viscosity suits printing and dispensing processes.

Product Details:

Our Sn62Pb36Ag2 is a type of mid temperature tin lead solder paste. It means that the alloy is formed by the 62% tin content, the 36% lead content, and the 2% silver content. Its working temperature can be classified as the preheat temperature from 90??? to 150???, the melting temperature of 183???, and the reflow temperature from 190??? to 100???. Therefore, this product is suitable for the highly demanding reflow-soldering work.

The Sn62Pb36Ag2 solder paste is one of the leaded products developed by our company. It conforms to the surface mount technology within the electronics industry. Our product has been exported to Canada, Lithuania, Kazakhstan, Colombia, Argentina, and other countries. Furthermore, we are seeking agents on a global scale. Welcome to contact us, if you are interested in our product.

Scope of Application:

• This Sn62Pb36Ag2 mid-temperature leaded solder paste is ideal for use in the PCB, SMT, LED circuit boards, various lighting fixtures, computer motherboards, phone motherboards, and a variety of precise circuit boards.

• Our Sn62Pb36 mid temperature tin lead solder paste features extremely good weldability. It can offer nice wetting property on the substrate made from different materials.
• The original shape will keep unchanged even after several hours of the printing process. Additionally, the surface mount assembly will not be affected.
• The viscosity is rarely changed during the continuous printing process. Also, it will not be altered, even after 8 hours of operation of the steel mesh. Moreover, our product can still maintain the favorable and continuous printing effect.
• Thanks to superb fluidity and nice soldering effect, our product can accomplish the exquisite printing of the pad, the separation distance of which can be only 0.3mm.

Product Details:

The Sn42Bi57Ag1 low temperature solder paste is a standard type of low-temperature silver solder paste. It offers great soldering performance, good electrical conductivity, and fatigue resistance that results in a high-quality solder.

Solder paste is commonly applied in the PCB industry for soft soldering sheet metal, lead tube, electric cables, radiators, bulbs, heating components of TVs, SMT reflow soldering, and other operations. 

Product Details:

Solder Preforms come in standard shapes such as squares, rectangles, washers and discs. Customized shape can be available upon request.

Application Examples
The solder preforms are used in a variety of applications such as: Die attach of semiconductor, LED and laser chips, thermal fuses, sealing, thermal interface, connectors and cables, vacuum and hermetic seals and gaskets, PCB assembly, mechanical attachment, package/lid sealing.

Quality Control

• Management system: ISO 9001, IATF16949
• Uses high purity raw material (Tin - 5N, gold and silver - 4N )
• Has strict control on using times of raw materials
• Composition and melting point testing must be performed on each batch of products.
• Random inspection according to the standards of GB/T2828S-3
  
  Dimensional inspection
  100% appearance inspection
  Performance inspection: oxidation, ductility, soldering
  
• Performs strict quality control on the sample, the first finished product and final product.

Additional Information:

• Production Capacity: 10000
• Delivery Time: 2-3 weeks
• Packaging Details: Box