Product Details:
Minimum Order Quantity | 1 Piece |
Brand | Jufeng |
Country of Origin | Made in India |
Main Elemental Composition | Tin (Sn) 96.5, silver (Ag) 3.0, copper (Cu) 0.5 |
Alloy Density | 7.4g/cm3 ( 20 Deg C) |
Solidus And Liquidus Temperatures | 217 ~ 219 Deg C |
Temperature | 300+10 Deg C/-0 Deg C, Anti-oxidation time: 30min+5min/-0min |
Packaging Type | Bottle |
Solder spheres are suitable for BGA (ball grid array), CSP (chip scale packages), semi-conductor packaging, SMT rework repair, etc.
Diameter | Tolerance | Diameter | Tolerance |
≥500 | ±20 | ???500 | ±10 |
Diameter | Sphericity???%??? | Diameter | Sphericity???%??? | Diameter | Sphericity???%??? |
100???150 | ???80 | 351???550 | ???92 | 651???760 | ???94 |
151???350 | ???90 | 551???650 | ???93 | 761???1000 | ???95 |
Diameter | Oxygen Content (%) | Diameter | Oxygen Content (%) |
???300 | ???0.0026 | ???300 | ???0.0015 |